Minimum wall thickness and draft angles for die castings are as follows
Min Thickness: 0.9 mm (0.35 in)
Min draft angle: 0.5 degrees
Material: Zinc alloys
Min Thickness: 0.01 mm (0.00039 in)
Min. draft angle: 0.25 degrees
At this stage, the packaging challenges of optoelectronic devices are facing the following issues.
- The first is how to design an efficient coupling system and temperature control system;
- the second is how to make use of packaging parasitic effect while single-tube devices are moving towards high-speed and large-bandwidth to compensates the chip’s shortcomings;
- the third is how to complete the feeding of multiple microwave signals in a limited space when the array devices are developing towards miniaturization and integration, as well as complete structural transformation and mode field matching.
We have all the optical module research and development facilities in house and we are here to cooperate with you to develop the 5G supporting products.